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NTLUS3192PZ
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient – Steady State (Note 3)
Junction-to-Ambient – t ≤ 5 s (Note 3)
Junction-to-Ambient – Steady State min Pad (Note 4)
Symbol
R θJA
R θJA
R θJA
Max
85
55
200
Units
° C/W
ELECTRICAL CHARACTERISTIC                S (T J = 25 ° C unles s otherwise specified)
Parameter
Symbol
Test Condition
Min
Typ
Max
Units
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
Drain-to-Source Breakdown Voltage
Temperature Coefficient
V (BR)DSS
V (BR)DSS /T J
V GS = 0 V, I D = ? 250 m A
I D = ? 250 m A, ref to 25 ° C
? 20
14
V
mV/ ° C
Zero Gate Voltage Drain Current
I DSS
V GS = 0 V,
V DS = ? 20 V
T J = 25 ° C
T J = 85 ° C
? 1.0
? 10
m A
Gate-to-Source Leakage Current
I GSS
V DS = 0 V, V GS = ± 8.0 V
10
m A
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
Negative Threshold Temp. Coefficient
V GS(TH)
V GS(TH) /T J
V GS = V DS , I D = ? 250 m A
? 0.4
2.5
? 1.0
V
mV/ ° C
Drain-to-Source On Resistance
R DS(on)
V GS = ? 4.5 V, I D = ? 3.0 A
65
85
m W
V GS = ? 2.5 V, I D = ? 1.5 A
V GS = ? 1.8 V, I D = ? 0.5 A
V GS = ? 1.5 V, I D = ? 0.2 A
90
120
160
115
160
250
Forward Transconductance
g FS
V DS = ? 5.0 V, I D = ? 0.2 A
2.0
S
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C ISS
C OSS
C RSS
V GS = 0 V, f = 1 MHz,
V DS = ? 10 V
450
85
65
pF
Total Gate Charge
Threshold Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Q G(TOT)
Q G(TH)
Q GS
Q GD
V GS = ? 4.5 V, V DS = ? 10 V;
ID = ? 3.0 A
5.5
0.3
0.8
1.6
8.5
nC
SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 6)
Turn-On Delay Time
t d(ON)
26
ns
Rise Time
Turn-Off Delay Time
Fall Time
t r
t d(OFF)
t f
V GS = ? 4.5 V, V DD = ? 10 V,
I D = ? 3.0 A, R G = 1 W
69
225
200
DRAIN-SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
VSD
V GS = 0 V,
I S = ? 1.0 A
T J = 25 ° C
T J = 85 ° C
0.72
0.7
1.2
V
Reverse Recovery Time
t RR
11
ns
Charge Time
Discharge Time
t a
t b
V GS = 0 V, dISD/dt = 100 A/ m s,
I S = ? 1.0 A
8.0
3.0
Reverse Recovery Charge
Q RR
6.0
nC
3.
4.
5.
6.
Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
Surface-mounted on FR4 board using the minimum recommended pad size of 30 mm 2 , 2 oz. Cu.
Pulse Test: pulse width ≤ 300 m s, duty cycle ≤ 2%.
Switching characteristics are independent of operating junction temperatures.
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